Fan-Out Packaging In Emerging Communication and Computing Products (IEEE Packaging Society Lecture)
This is a past event.
Tuesday, February 18 at 11:00am
EC - Engineering Center, 3930
10555 W Flagler ST 33174, Engineering Center, Miami, Florida 33174
Beth Keser, PH.D.Director, Package Engineering, Intel Corporation, will be talking about the advantages of FO-WLP, potential application spaces, package structures available in the industry, and benchmarking