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Fan-Out Packaging In Emerging Communication and Computing Products (IEEE Packaging Society Lecture)

This is a past event.

Tuesday, February 18 at 11:00am

EC - Engineering Center, 3930
10555 W Flagler ST 33174, Engineering Center, Miami, Florida 33174

Beth Keser, PH.D.Director, Package Engineering, Intel Corporation, will be talking about  the advantages of FO-WLP, potential application spaces, package structures available in the industry, and benchmarking

Event Type

Academics, Lectures & conferences

Audience

General Public

Department
Department of Biomedical Engineering
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